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CarverLMS230 is the premium machine special for window cutting in the mobile telephone industry.
The travel of X axis is 460 mm and the space between dual spindle axes is 230 mm, these data matchs to the width size of work-piece after silk printing.
The dual spindle axes are equipped and max. spindle speed can reach 60000rpm. Each spindle axis can move independently, so both of dual work station machining and dual process machining are available.
An evelop is equipped on the upper part of the beam, thus making a sealed space to prevent the chips splashing from the back of the beam.
The column, the beam and the head are all cast iron to increase the rigidity and deduce the vibration in machining.
Considering the characteristics of PC plates machining, a sprayer is equipped on the machine. Its airflow would blow away the chips on zhe work-piece, while the water fog can cool down the work-piece. There is a wind-cooling buttom on zhe Operation Control Panel and a water tank inside the machine. The water would flow out from the tank by siphonage.
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